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Please be advised that due to the ongoing supply issues with raw materials affecting the global electronics industry, as well as an increase in orders received by our manufacturing partners, a large number of products are facing increased lead times in recent months. For the latest lead time and stock availability, please contact one of our engineers who will be happy to discuss lead times further and the potential for alternative parts.
Closed with Temperature Diode series
Supporting Manufacturer Information
- Merit Sensor Application Note (AN101)
- Merit Sensor Application Note (AN102)
- Merit Sensor Application Note (AN103)
- Merit Sensor Application Note (AN104)
- Merit Sensor Application Note (AN105)
- Merit Sensor CA Proposition 65 Declaration
- Merit Sensor Case Study for BP Series Blood Pressure Sensor
- Merit Sensor Case Study for Medical systems including inflation devices
- Merit Sensor Case Study for Tier 1 automotive supplier pressure transducers
- Merit Sensor Conflict Minerals Policy
- Merit Sensor Product Selection Guide
- Merit Sensor REACH Compliance
- Merit Sensor RoHS Compliance (MEMs Silicon Die)
- Merit Sensor RoHS Compliance (Pressure Sensor Packages)
- Merit Sensor RoHS Compliance (TR & TVC Series)
- Harsh media low and medium pressure MEMS sensing element
- Suitable for air, gases and liquids that are compatible with silicon and glass
- Bridge options of closed or closed with temperature diode available
- Parts supplied as sawn wafer on tape in metal frame or die in waffle pack
