Packaged IGBT switch assemblies for high-voltage, high-current conversion, with die, isolation and baseplate integrated into one module. Specified in inverter, motor drive and traction designs needing a compact switching stage and a defined thermal path.
Silicon carbide power modules with gate drive, protection and sensing built in alongside the switches. The wide bandgap device allows a higher switching frequency and a smaller magnetics and cooling budget in inverter and motor control stages.
Working alongside your design team from the earliest stage, we help you select the right part for the application and, where a standard part will not do, develop customised components with our manufacturing partners such as lead length, termination and package size.
Power conversion stages supplied as a finished module, with switching, isolation and thermal management already integrated. Two families are held: IGBT power modules and silicon carbide intelligent power modules, which add gate drive and protection inside the package.
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