Military & Defence

Selection of ‘EEE’ approved surface-mount current sensing resistors by Isabellenhütte and ultra-precision resistors from Vishay Foil Resistors
Selection of Military grade surface mount, high voltage chip resistors from Ohmcraft.

Cissoid’s range of semiconductors designed especially for high temperature applications and harsh environments.

‘EEE’ approved pressure sensors from Emerson Paine™.

Robust and accurate general purpose load cells from Lord Sensing Stellar Technology.

Thermocouple foil temperature sensors by RdF.

Military & Defence

  • InterFET

J309

InterFET Product Image (TO-92)
InterFET J309 N-Channel JFET with N0072S Geometry. Typical leakage of -3pA and a low input capacitance of 5pF (max). All of this in a TO-92 package.
  • Compliant
J309
  • InterFET

J310

InterFET Product Image (TO-92)
InterFET J310 N-Channel JFET with N0072S Geometry. Typical leakage of -3pA and a low input capacitance of 5pF (max). All of this in a TO-92 package.
  • Compliant
J310
  • InterFET

J507

InterFET Product Image (TO-92-2L)
InterFET J507 N-Channel Current Regulator Diode with N0016H Geometry. Typical leakage of -1.5pA. All of this in a TO-92-2L package.
  • Compliant
J507
  • ​Metis Engineering Ltd

Metis Engineering H Guard

Metis Engineering H Guard

H Guard is a CAN based sensor that can measure absolute pressure, air temperature, H2 (Hydrogen), absolute air water content, relative humidity, dew point temperature and 3 axis acceleration.

  • Absolute Pressure: 0.3 to 1.2 Bar
  • Air Temperature: -40°C to +125°C
  • Relative Humidity: 0% to 100%
  • Dew Point Temperature: 0 to 100°C
  • Accelerometer Range: -24 to +24g
  • InterFET

P1086

InterFET Product Image (TO-92)
InterFET P1086 P-Channel JFET with P0099F Geometry. Typical leakage of 5pA and a low input capacitance of 45pF (max). All of this in a TO-92 package.
  • Compliant
P1086
  • InterFET

PAD1

InterFET Product Image (TO-18)
InterFET PAD1 N-Channel PicoAmp Diode with N0001H Geometry. Typical leakage of -0.5pA. All of this in a TO-18 package.
  • Compliant
PAD1
  • InterFET

PN4117

InterFET Product Image (TO-92)
InterFET PN4117 N-Channel JFET with N0001H Geometry. Typical leakage of -1pA and a low input capacitance of 3pF (max). All of this in a TO-92 package.
  • Compliant
PN4117
  • InterFET

PN4117A

InterFET Product Image (TO-92)
InterFET PN4117A N-Channel JFET with N0001H Geometry. Maximum leakage of -1pA and a low input capacitance of 3pF (max). All of this in a TO-92 package.
  • Compliant
PN4117A
  • RdF

RdF 20100 Series

  • Butt bonded foil thermocouple
  • Micro-foil® thickness of 0.0128mm (0.0005″)
  • Insulation resistance of 50MΩ at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Removable Kapton® frame for bare foil applications
  • Standard lead length of 6″, additional lengths available on request
  • RdF

RdF 20101 Series

  • Butt bonded foil thermocouple
  • Micro-foil® thickness of 0.0128mm (0.0005″)
  • Insulation resistance of 50MΩ at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Removable Kapton® frame for bare foil applications
  • Standard lead length of 6″, additional lengths available on request
  • RdF

RdF 20102 Series

  • Butt bonded foil thermocouple
  • Micro-foil® thickness of 0.0128mm (0.0005″)
  • Insulation resistance of 50MΩ at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Removable Kapton® frame for bare foil applications
  • Standard lead length of 6″, additional lengths available on request
  • RdF

RdF 22810 Series

  • Polyimide insulated flexible RTD Stikon® temperature sensor
  • Standard sensing element is platinum with a resistance of 100Ω at 0°C
  • 3 or 4 conductor ribbon cable
  • Customisible cable lengths
  • RdF

RdF 26721 Series

  • Stikon® type E thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate
  • RdF

RdF 26722 Series

  • Stikon® type E thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate
  • RdF

RdF 26723 Series

  • Stikon® type K thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate
  • RdF

RdF 26724 Series

  • Stikon® type J thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate

J309

InterFET J309 N-Channel JFET with N0072S Geometry. Typical leakage of -3pA and a low input capacitance of 5pF (max). All of this in a TO-92 package.
InterFET Product Image (TO-92)

J310

InterFET J310 N-Channel JFET with N0072S Geometry. Typical leakage of -3pA and a low input capacitance of 5pF (max). All of this in a TO-92 package.
InterFET Product Image (TO-92)

J507

InterFET J507 N-Channel Current Regulator Diode with N0016H Geometry. Typical leakage of -1.5pA. All of this in a TO-92-2L package.
InterFET Product Image (TO-92-2L)

Metis Engineering H Guard

H Guard is a CAN based sensor that can measure absolute pressure, air temperature, H2 (Hydrogen), absolute air water content, relative humidity, dew point temperature and 3 axis acceleration.

  • Absolute Pressure: 0.3 to 1.2 Bar
  • Air Temperature: -40°C to +125°C
  • Relative Humidity: 0% to 100%
  • Dew Point Temperature: 0 to 100°C
  • Accelerometer Range: -24 to +24g
Metis Engineering H Guard

P1086

InterFET P1086 P-Channel JFET with P0099F Geometry. Typical leakage of 5pA and a low input capacitance of 45pF (max). All of this in a TO-92 package.
InterFET Product Image (TO-92)

PAD1

InterFET PAD1 N-Channel PicoAmp Diode with N0001H Geometry. Typical leakage of -0.5pA. All of this in a TO-18 package.
InterFET Product Image (TO-18)

PN4117

InterFET PN4117 N-Channel JFET with N0001H Geometry. Typical leakage of -1pA and a low input capacitance of 3pF (max). All of this in a TO-92 package.
InterFET Product Image (TO-92)

PN4117A

InterFET PN4117A N-Channel JFET with N0001H Geometry. Maximum leakage of -1pA and a low input capacitance of 3pF (max). All of this in a TO-92 package.
InterFET Product Image (TO-92)

RdF 20100 Series

  • Butt bonded foil thermocouple
  • Micro-foil® thickness of 0.0128mm (0.0005″)
  • Insulation resistance of 50MΩ at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Removable Kapton® frame for bare foil applications
  • Standard lead length of 6″, additional lengths available on request

RdF 20101 Series

  • Butt bonded foil thermocouple
  • Micro-foil® thickness of 0.0128mm (0.0005″)
  • Insulation resistance of 50MΩ at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Removable Kapton® frame for bare foil applications
  • Standard lead length of 6″, additional lengths available on request

RdF 20102 Series

  • Butt bonded foil thermocouple
  • Micro-foil® thickness of 0.0128mm (0.0005″)
  • Insulation resistance of 50MΩ at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Removable Kapton® frame for bare foil applications
  • Standard lead length of 6″, additional lengths available on request

RdF 22810 Series

  • Polyimide insulated flexible RTD Stikon® temperature sensor
  • Standard sensing element is platinum with a resistance of 100Ω at 0°C
  • 3 or 4 conductor ribbon cable
  • Customisible cable lengths

RdF 26721 Series

  • Stikon® type E thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate

RdF 26722 Series

  • Stikon® type E thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate

RdF 26723 Series

  • Stikon® type K thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate

RdF 26724 Series

  • Stikon® type J thermocouple
  • Insulation resistance of 50MΩ minimum at 50VDC in Ungrounded junction TCs
  • 2 wire configuration
  • Kapton® case material
  • Embeded in a paper thin laminate

Resources

Related Articles