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Please be advised that due to the ongoing supply issues with raw materials affecting the global electronics industry, as well as an increase in orders received by our manufacturing partners, a large number of products are facing increased lead times in recent months. For the latest lead time and stock availability, please contact one of our engineers who will be happy to discuss lead times further and the potential for alternative parts.
CD series
- Low resistance precision flip-chip surface-mount resistor
- Utilises the proven Caddock Micronox® resistance films to achieve the unique low resistance range
- Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
- Chip size of 2015
- Bare ceramic back surface
- Inductance of less than 5nH typical
- Maximum chip temperature of +150°C
- Temperature range of -55°C to +150°C
- Low resistance precision wire-bondable surface-mount resistor
- Utilises the proven Caddock Micronox® resistance films to achieve the unique low resistance range
- Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
- Chip size of 2015
- Aluminium wire to be used for bonding
- Inductance of less than 5nH typical
- Maximum chip temperature of +150°C
- Temperature range of -55°C to +150°C
- Low resistance precision flip-chip surface-mount resistor
- Utilises the proven Caddock Micronox® resistance films to achieve the unique low resistance range
- Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
- Chip size of 2520
- Bare ceramic back surface
- Inductance of less than 5nH typical
- Maximum chip temperature of +150°C
- Temperature range of -55°C to +150°C
- Low resistance precision wire-bondable surface-mount resistor
- Utilises the proven Caddock Micronox® resistance films to achieve the unique low resistance range
- Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
- Chip size of 2520
- Aluminium wire to be used for bonding
- Inductance of less than 5nH typical
- Maximum chip temperature of +150°C
- Temperature range of -55°C to +150°C
