The Engineering Design Show, 8 – 9 October 2025, Coventry Building Society Arena, UK, Stand J3
The Ohmcraft HVCD Series 3512 chip divider is a high-precision, high-voltage surface-mount component designed for demanding applications requiring stable and accurate voltage division. Utilising Ohmcraft’s proprietary Micropen® precision printing technology, the HVCD 3512 achieves superior performance with resistance values ranging from 40 MΩ to 10 GΩ. With a voltage rating of up to 2,000V and ratio tolerances as tight as ±1%, this chip divider ensures accurate and consistent operation in high-voltage circuits. The low TCR tracking of ±25 ppm/°C enhances temperature stability, while its ultra-low noise characteristics make it ideal for precision measurement and control applications. The compact 3512 package allows for efficient PCB layout in space-constrained designs.
Key Features:
Dimensions | 0.76 x 5.08 x 12.7mm |
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Series / Model | |
Package / Size | |
Temperature Coefficient | |
Resistance Value | |
Tolerance | |
Termination / Connection | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS), Solderable Single Surface Sn63Pb37 (Non-RoHS), Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS), Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) |
Product Type | |
Design Technology | SMD (surface mount) |
Minimum Resistance | 40MΩ |
Maximum Resistance | 10GΩ |
Voltage Rating | |
Temperature Range (°C) | -55 to +150°C |
Y – ±25ppm/°C
Z – ±50ppm/°C
Resistance value is expressed as a four-digit number where the first three numbers are the significant value, and the fourth number is the number of zeros.
(R total) / (R low) expressed up to a four digit number
Max Ratio = 1000
Min Ratio = 100
SKU | Series / Model | Package / Size | Temperature Coefficient | Resistance Value | Tolerance | Termination / Connection |
---|---|---|---|---|---|---|
HVCD3512YxxxxFS-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±1% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512YxxxxGS-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±2% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512YxxxxJS-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±5% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512YxxxxKS-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±10% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512YxxxxLS-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±20% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512YxxxxFT-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±1% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxGT-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±2% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxJT-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±5% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxKT-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±10% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxLT-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±20% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxFB-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±1% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512YxxxxGB-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±2% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512YxxxxJB-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±5% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512YxxxxKB-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±10% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512YxxxxLB-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±20% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512YxxxxFZ-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±1% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxGZ-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±2% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxJZ-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±5% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxKZ-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±10% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512YxxxxLZ-Rxxxx | HVCD | 3512 | ±25 ppm/°C | ±20% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxFS-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±1% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512ZxxxxGS-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±2% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512ZxxxxJS-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±5% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512ZxxxxKS-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±10% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512ZxxxxLS-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±20% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
HVCD3512ZxxxxFT-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±1% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxGT-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±2% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxJT-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±5% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxKT-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±10% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxLT-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±20% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxFB-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±1% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512ZxxxxGB-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±2% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512ZxxxxJB-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±5% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512ZxxxxKB-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±10% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512ZxxxxLB-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±20% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
HVCD3512ZxxxxFZ-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±1% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxGZ-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±2% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxJZ-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±5% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxKZ-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±10% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
HVCD3512ZxxxxLZ-Rxxxx | HVCD | 3512 | ±50 ppm/°C | ±20% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) |
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