Space Tech Expo Europe, 18-20th November 2025, Bremen, Germany, Stand G56
The Ohmcraft HVCD Series 5020 chip divider is a high-precision, high-voltage surface-mount component designed for demanding applications requiring stable and accurate voltage division. Utilising Ohmcraft’s proprietary Micropen® precision printing technology, the HVCD 5020 achieves superior performance with resistance values ranging from 160 MΩ to 10 GΩ. With a voltage rating of up to 4,000V and ratio tolerances as tight as ±1%, this chip divider ensures accurate and consistent operation in high-voltage circuits. The low TCR tracking of ±25 ppm/°C enhances temperature stability, while its ultra-low noise characteristics make it ideal for precision measurement and control applications. The compact 5020 package allows for efficient PCB layout in space-constrained designs.
Key Features:
| Dimensions | 0.76 x 5.08 x 12.7mm | 
|---|---|
| Series / Model | |
| Package / Size | |
| Temperature Coefficient | |
| Resistance Value | |
| Tolerance | |
| Termination / Connection | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS), Solderable Single Surface Sn63Pb37 (Non-RoHS), Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS), Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | 
| Product Type | |
| Design Technology | SMD (surface mount) | 
| Minimum Resistance | 160MΩ | 
| Maximum Resistance | 10GΩ | 
| Voltage Rating | |
| Temperature Range (°C) | -55 to +150°C | 
Y  – ±25ppm/°C
Z  – ±50ppm/°C
Resistance value is expressed as a four-digit number where the first three numbers are the significant value, and the fourth number is the number of zeros.
(R total) / (R low) expressed up to a four digit number
Max Ratio = 1000
Min Ratio = 100
| SKU | Series / Model | Package / Size | Temperature Coefficient | Resistance Value | Tolerance | Termination / Connection | 
|---|---|---|---|---|---|---|
| HVCD5020YxxxxFS-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±1% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020YxxxxGS-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±2% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020YxxxxJS-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±5% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020YxxxxKS-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±10% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020YxxxxLS-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±20% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020YxxxxFT-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±1% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxGT-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±2% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxJT-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±5% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxKT-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±10% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxLT-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±20% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxFB-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±1% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020YxxxxGB-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±2% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020YxxxxJB-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±5% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020YxxxxKB-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±10% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020YxxxxLB-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±20% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020YxxxxFZ-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±1% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxGZ-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±2% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxJZ-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±5% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxKZ-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±10% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020YxxxxLZ-Rxxxx | HVCD | 5020 | ±25 ppm/°C | ±20% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxFS-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±1% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020ZxxxxGS-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±2% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020ZxxxxJS-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±5% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020ZxxxxKS-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±10% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020ZxxxxLS-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±20% | Solderable Single Surface Sn63Pb37 (Non-RoHS) | |
| HVCD5020ZxxxxFT-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±1% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxGT-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±2% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxJT-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±5% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxKT-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±10% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxLT-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±20% | Solderable Wraparound Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxFB-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±1% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020ZxxxxGB-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±2% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020ZxxxxJB-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±5% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020ZxxxxKB-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±10% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020ZxxxxLB-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±20% | Solderable Wraparound Sn63Pb37 on Nickel Barrier (Non-RoHS) | |
| HVCD5020ZxxxxFZ-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±1% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxGZ-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±2% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxJZ-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±5% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxKZ-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±10% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | |
| HVCD5020ZxxxxLZ-Rxxxx | HVCD | 5020 | ±50 ppm/°C | ±20% | Solderable Single Surface Matte Tin Sn99.9 on Nickel Barrier (RoHS) | 
| Product name | SKU | Datasheet | ||
|---|---|---|---|---|
|   | Exxelia Ohmcraft HVCD 3512 | Exxelia Ohmcraft HVCD 3512 | View Product | |
|   | Exxelia Ohmcraft HVCD 4020 | Exxelia Ohmcraft HVCD 4020 | View Product | |
|   | Exxelia Ohmcraft HVCD 5020 | Exxelia Ohmcraft HVCD 5020 | View Product |