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Wire Bondable series
- Low resistance precision wire-bondable surface-mount resistor
- Metalised back surface for soldering to a heat sink with bondable termination pads
- 2-terminal current sense resistor with 4-terminal connections available (see datasheet for further details)
- Chip size of 2015
- Aluminium wire to be used for bonding
- Inductance of less than 5nH typical
- Maximum chip temperature of +150°C
- Temperature range of -55°C to +150°C
- Non-magnetic thick film chip resistor
- Resistance range from 10Ω to 100GΩ
- Tolerances from ±5.0% to ±30%
- TCR from ±100 ppm/°C to ±3000 ppm/°C
- Power rating of 0.1W (at +70°C)
- Temperature from -55°C to +155°C
- Non-magnetic thick film chip resistor
- Resistance range from 10Ω to 1TΩ
- Tolerances from ±5.0% to ±30%
- TCR from ±100 ppm/°C to ±3000 ppm/°C
- Power rating of 0.125W (at +70°C)
- Temperature range from -55°C up to +155°C
- Non-magnetic thick film chip resistor
- Resistance range from 10Ω to 1TΩ
- Tolerances from ±5.0% to ±30%
- TCR from ±100 ppm/°C to ±2000 ppm/°C
- Power rating of 0.25W (at +70°C)
- Temperature range from -55°C to +155°C
